While CES saw a number of announced products running on NVIDIA‘s dual-core Tegra 2 chipset, Qualcomm’s dual-core Snapdragon coming later this year may offer a number of competitive technological advantages over its earlier released competitor. The MSM 8960 ARM-based chip is essentially a smartphone in a die.
The architecture of the Qualcomm Snapdragon MSM 8960 encompasses a number of different items, including a dual-core micro-architecture CPU that is said to offer 5X the performance of its predecessor at 75% reduced power, integrated multi-mode modem for LTE 4G and 3G connectivity, integrated graphics that delivers 4 times the performance of previous generation chips, and also integrated radios for WLAN (WiFi), GPS, Bluetooth, and FM radio.
With a fully integrated smartphone system inside the chip die, Qualcomm is hoping its chip solution would offer smartphone manufacturers more capabilities at reduced cost. Moreover, with the small space inside smartphones and tablets, having all these various components integrated onto a single chip would free up space for other innovations, such as NFC integration or adding more on-board memory (RAM) or storage.
The new chip should appear in tablets from Acer, Compal, and Pantech, along with some un-named products at this time. The Asus Eee Pad MeMO tablet will also be utilizing this next-generation Snapdragon solution.