You have to say this about VIA Technologies, they are indeed going for it in their battle for the ultra-portrable space. They’ve just announced an ‘open source’ reference design called the OpenBook Mini-Note, intended to give OEMs an easier path to build mini-notebooks, that of course include VIA’s chipsets. Here’s a snip from the press release:

Powered by the VIA C7-M ULV processor and the VIA VX800 digital media IGP chipset, the VIA OpenBook mini-note reference design is a small, 1kg, 8.9" mini-notebook form factor design that supports screen resolutions of up to 1024x600 and high performance VIA Chrome9™ DirectX™ 9.0 3D graphics. Advanced video acceleration for MPEG-2, MPEG-4, WMV9, VC1 and DiVX video formats, a VMR capable HD video processor and 8-channel HD audio make it a highly media rich mini-notebook platform.

The VIA OpenBook mini-note reference design offers unrivaled broadband connectivity options VIA OpenBook Reference Design (camera)though two internal modules, with the first one featuring WiFi, Bluetooth, and optional AGPS connections and the second one offering a choice of WiMAX, HSDPA, or EV-DO/W-CDMA options. In addition, the VIA OpenBook also comes with three USB 2.0 ports, a VGA port, and audio-in/audio-out jacks as well as a 4-in-1 card reader (SD/SDIO/MMC/MS) and a 2 mega-pixel dual-headed web camera.

The VIA OpenBook supports a wide range of operating system environments, including Microsoft Windows Vista Basic, Microsoft Windows XP, and various Linux distributions. The device features up to 2GB DDR2 DRAM and can be equipped with a choice of hard disk drive and solid state storage options.

As a part of this initiative, VIA is making the CAD drawings for this reference design available on their site.

Will we see a flood of new models? It will be interesting to see how this affects the mini-notebook line going forward. 

Here’s a link to the press release and here’s a link to the VIA OpenBook site. Below is the promotional video from VIA.

Via CrunchGear

Here’s a link to an interesting article in the San Francisco Chronicle that gives a little background on the battle between Intel and VIA Technologies as they work to get their chips into your ultra-portable device. Taking the tack that Intel’s Atom chipset is aimed squarely at VIA’s efforts to produce low energy consumption chips, the article casts VIA as the underdog in what is sure to be an intiguing and (let’s hope) competitive battle. Worth a read.

VIA is announcing details on the VX800 chipset for ultra-mobile devices. Aimed at Intel’s Atom, Steve “Chippy” Paine is positing that we won’t be seeing this in MIDs, but more than likely in UMPCs or the ultra-portable devices (think CloudBook). He’s also speculating that the new HP 2133 UMPC will run the VX800.

Some of the key features listed in the press release:

• High Performance 3D Graphics: The VIA Chrome9™ HC3 integrated graphics core boasts full DirectX 9.0 support
• Powerful Image Enhancement Technology: The VIA Chromotion™ video engine delivers a Hi-Def™ visual experience, including advanced video acceleration for MPEG-2, MPEG-4, WMV9, VC1 and DiVX video formats, plus a VMR capable HD video processor.
• The Warmth of HD Audio: The built-in VIA Vinyl HD Audio controller supports up to eight high definition channels with a 192kHz sampling rate, delivering a richer all-round digital media experience.
• Intuitive Memory Technology: VIA's renowned memory controller technology supports the lower power, high-bandwidth DDR2 memory modules.
• Seamless Networking: Makes Wifi connectivity easy, with added support for Gigabit Ethernet networking (VIA VX800) and 10/100 Fast Ethernet.
• Extended Peripheral Connectivity: Interconnects up to PCI Express (VIA VX800) for high bandwidth peripherals, plus hard drive connectivity up to SATA II as well as PATA (IDE), six USB2.0 ports, and four PCI slots.
• Display Flexibiity: An integrated multi-configuration LVDS transmitter enables display connection to embedded panels, as well as CRT monitors.

Here’s a link to the press release.

According to this report from cnet, the new Isaiah chip from Via, designed by subsidiary Centaur and manufactured by Fujitsu, is being sent to OEMs for testing. The new Isaiah chip, which is pin compatible with the C7, is reportedly two to four times faster than the C7 chip. Centaur's CEO, Glenn Henry, said Via plans to release the chip around May - June. Plans for a dual-core Isaiah chip are also in the works. Learn more about the Isaiah chip here.

This bodes good news for companies like OQO, which currently use Via's C7 chip. I don't know about you, but a two to four time performance boost on the Model 02, coupled with the currently shipping 32 gb and 64 gb ssd, makes the small form factor Tablet PC very attractive.

Here is the second installment of UltraMobileLife.com Weekly News

UltraMobileLife is begun a new weekly video recap of ultra-mobile news. In this first edition, they point to my InkShow video review of the Amtek T770 UMPC.

Subscribe here and watch the first edition below:

During the OQO product upgrade briefing this past Thursday, I hooked up with Via, and they interviewed me to talk about processors, battery life, and my experience with the OQO Model 02 that I purchased.

Follow the Read More for that interview and one they did with OQO's Dennis Moore and Bob Rosin

Bjron Stromberg, of Via's UltraMobileLife blog, recently snagged two UMPC samples, the Via Nanobook and the Packard Bell EasyNote, from VIA's storage room and holed himself up in a meeting room to shoot this video for us all.

Good stuff, Bjorn. Hope your bosses at VIA are good to you when the find this video